IS61QDPB42M36A2-550M3L

Basic Information Overview

• Category: Integrated Circuit (IC)
• Use: Memory module
• Characteristics: High-speed, low-power, synchronous dynamic random-access memory (SDRAM)
• Package: BGA (Ball Grid Array)
• Essence: Storage and retrieval of digital information in electronic devices
• Packaging/Quantity: Single unit per package

Specifications

• Model: IS61QDPB42M36A2-550M3L
• Capacity: 4 Gigabits (Gb)
• Organization: 256 Megabytes (MB) x 16 bits x 4 banks
• Speed: 550 Megahertz (MHz)
• Voltage: 1.8 Volts (V)
• Operating Temperature Range: -40°C to +85°C
• Refresh Mode: Auto-refresh and self-refresh
• Interface: Double Data Rate (DDR) SDRAM

Detailed Pin Configuration

The IS61QDPB42M36A2-550M3L has a total of 90 pins. The pin configuration is as follows:

| Pin Number | Pin Name | Description | |------------|----------|-------------| | 1 | VDD | Power supply voltage | | 2 | VDDQ | Power supply voltage for input/output buffers | | 3 | DQ0 | Data input/output bit 0 | | 4 | DQ1 | Data input/output bit 1 | | ... | ... | ... | | 89 | VSSQ | Ground for input/output buffers | | 90 | VSS | Ground |

Functional Features

• High-speed data transfer rate
• Low power consumption
• Synchronous operation with the system clock
• On-die termination for improved signal integrity
• Burst mode for efficient data transfer
• Auto and self-refresh modes for memory retention

Advantages and Disadvantages

Advantages: - High-speed operation allows for faster data access - Low power consumption helps in reducing energy usage - Synchronous operation ensures reliable data transfer - On-die termination improves signal quality - Auto and self-refresh modes enhance memory retention

Disadvantages: - Limited capacity compared to other memory modules - Higher cost per unit compared to traditional memory technologies

Working Principles

The IS61QDPB42M36A2-550M3L is based on synchronous dynamic random-access memory (SDRAM) technology. It stores digital information in a matrix of capacitors, with each capacitor representing a single bit of data. The memory module operates synchronously with the system clock, allowing for precise timing and reliable data transfer. When data is read from or written to the memory, it is accessed in bursts, which improves overall efficiency.

Detailed Application Field Plans

The IS61QDPB42M36A2-550M3L memory module is commonly used in various electronic devices that require high-speed and low-power memory. Some of its application fields include: 1. Personal computers and laptops 2. Servers and data centers 3. Networking equipment 4. Graphics processing units (GPUs) 5. Embedded systems and industrial applications

Detailed and Complete Alternative Models

1. IS61QDB42M36A2-550M3L: Similar specifications but with a different package type (TSOP instead of BGA).
2. IS61QDPB42M36A2-667M3L: Higher speed variant operating at 667MHz.
3. IS61QDPB42M36A2-400M3L: Lower speed variant operating at 400MHz.
4. IS61QDPB42M36A2-550M3LX: Extended temperature range variant (-40°C to +105°C).

Note: This is not an exhaustive list, and there may be other alternative models available in the market.

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